| Item |
Descript |
| 1. IQC |
Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products |
| 2. IPQC |
In-process quality control, Every process on line sampling inspection |
| 3. Chemical analysis |
Chemical analysis to control on line chemical solution within control range |
| 4. Physical Laboratory |
To do reliability test and outgoing inspection items |
| 5. Micro-section |
To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness |
| 6. Black Light inspection |
To analysis the PTH hole copper coverage before Panel copper plating |
| 7. Lamination thickness measurement |
To control the product thickness quality even distribution and thickness tolerance under control |
| 8. L/S measurement control by 3D |
To control the products after Pattern plating within the design spec. ( Line width and Space width) |
| 9. CMI measure copper thickness |
CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section |
| 10. Impedance measurement |
For measuring Impedance control products ( Single strip, Differential …) |
| 11. Peel strength test |
Testing Solder Mask adhesive |
| 12. X-ray monitor multi layer drilling |
It control inner and outer layer registration |
| 13. Hole AOI |
To check hole location compare with Gerber design location accurace |
| 14. XRF measure Nickel & Gold thickness |
To measuring surface finishing metal thickness |
| 15. Hi-Pot test |
To checking dielectric insulation capability |
| 16. 100% O/S test |
To checking circuit normal function as design circuit |
| 17. Hole counter |
To check missing hole, hole size out spec., no excess holes |