| Item |
Processing Capability |
| Surface Finish |
OSP, Immersion Ag/Gold, LF-HASL, HASL, Silver/Gold Plating |
| Solder Mask Color |
White, Black, Green, Yellow, Blue, Red |
| Laminate Type |
Aluminum/Copper/Iron Core PCB, FR-4, CEM-1, CEM-3, Flex-PCB |
| Thermal Conductivity |
1.0 Standard, 2.0 Middle, 2.5, 3.0 High |
| Scale of Dimension |
500×550mm; 350×1200mm |
| Scale of Board Thickness |
0.05mm, 0.60mm, 0.80mm, 1.00mm, 1.20mm, 1.60mm, 2.00mm, 3.00mm |
| Copper Foil Thickness |
0.5-6 OZ |
| Tolerance of Board Thickness |
±0.10mm |
| Dielectric thickness |
0.075～0.15mm |
| Break-down Voltage |
1600-5000V |
| layer |
Single and Double Sided, COB, Multi-layer(3-8 layers) |